January 24, 2014
High-speed connectors from ERNI Electronics support data rates of more than 25 Gbps
According to a conservative specification, the high-speed connectors of the MicroSpeed family from ERNI Electronics permit data rates of up to 20 Gbps (differentially).
Current measurements and simulations now prove that, with corresponding design criteria and layout (-2dB insertion loss, 5 mm board-to-board spacing), even data rates of more than 25 Gbps are possible. This in turn allows extremely fast board-to-board connections with distances of 5 to 20 mm to be realized.
The modular, shielded connectors with 1.0 mm pitch are available as a two-row version with 50 pins for the temperature range from -55 °C to +125 °C. In addition to right-angle variants in the two-row design and robust blind-mate versions, seven-row versions with 91 and 133 pins respectively are also available.
The signal contacts feature SMT termination, while two options are available for the shield contacts - namely, SMT or through hole reflow (THR) for particularly heavy plug-in boards or high mechanical loading. The SMT coplanarity is fully guaranteed and specified with less than 0.10 mm for all the contacts. The longitudinal pitch of 1.0 mm and the row spacing of 1.5 mm permit horizontal and vertical arrangements of the differential pairs or single-ended signals - depending on the application and/or requirement with regard to crosstalk. Optimum crosstalk behavior can be achieved by means of special layout configurations - with ERNI providing support here in the form of field-tested suggestions. Corresponding test data are available upon request. Mating cycles > 500 are specified for the MicroSpeed connectors. The current carrying capacity is 1.0 A for the signal contacts and 6.8 A for the contacts of the special power modules.
MicroSpeed connectors are supplied in tape-on-reel packaging. Further design features for fully automatic assembly are: black insulators from high-temperature-resistant LCP for rapid and reliable visual detection in addition to a pre-mounted pick and place pad to facilitate gripping.
Demo boards, SPICE models and an evaluation kit are all available for the MicroSpeed connectors.
ERNI Electronics will present its innovative product portfolio at Embedded World in Nuremberg (February 25 - 27, 2014, Hall 4, Booth 348).