October 7, 2013
ERNI Electronics Provides Tailor-Made Protection for Electronic Assemblies
ERNI Electronics expands its service offering providing efficient and reliable coating for electronic boards and assemblies.
The company addresses the increasing market need on reliable protection of modern boards and electronic components. To fulfill the various application demands ERNI offers three different coating processes. When selecting the process technologies, the goal was to avoid complex and time consuming manual masking work - as is often common with spraying and immersion processes.
Increasing requirements for the quality, reliability and operating life of electronic assemblies as well as a growing packing density of the components make a protective coating more and more important. Constructed assemblies can be protected against moisture, dust, dirt, contamination and mechanical loads by means of special coating processes in order to prevent a functional impairment. In addition the coating hampers the unauthorized copying of the electronic designs.
Using latest equipment ERNI offers three different coating processes:
Fluoro Polymer Coating: This process provides a protective layer thickness of approx. 1μm. It is based on the complete immersion of the assembly in the coating bath without masking off metallic contact surfaces. In the event of contact, the protective layer is pierced. Assemblies can be repaired following coating
Selective Thin Film Coating: This is a fully automated lacquer curtain coating process. The surfaces to be coated (select coat process) can be individually programmed. The fluorescent protective layer simplifies the optical inspection.
Selective Thick Film Coating: This approach provides protective layer thicknesses up to approx. 2 mm. Therefore an additional sight proofing and protection against
Contact is reached. It also enables a secure application of "boundaries", that can
be filled with pourable lacquers (dam & fill process).
With the powerful coating technologies ERNI Electronics is expanding its broad EMS portfolio. The offering includes SMT fine pitch assembly, SMT and THR soldering, THT wave soldering, coating, AOI, In-circuit and Boundary Scan tests, device programming, development of test instruments and test software.