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October 14, 2014

ERNI Electronics Introduces High-Density and Compact High-Speed Connectors

ERNI Electronics expands its popular MicroSpeed high-speed connector family, introducing variants with three contact rows.

The shielded connector family with 1mm pitch enables high-speed data applications with up to 25 Gbps. The new connectors are ideal for next generation communication standards like Ethernet 100 Gbps (IEEE 802.3ba), Optical Internetworking Forum (OIF), USB 3.1 etc. Typical applications which will benefit from the new connectors are data communication and telecommunication, high-end computing, medical technology or industrial automation with high speed transmissions and high data volumes.

The new 3-row versions with SMT terminals provide a high contact density. The straight (180 °) connectors are available with 75 and 192 pins (3 x 25 and 3 x 64) -additional pin numbers can be offered on custom need. To address a broad spectrum of applications the new connectors offers maximum grounding and routing flexibility (single-ended and differential signaling).

The center (third) row can be assigned as ground path, to reduce the row-to-row crosstalk between the two signal rows. Alternatively the third row can be used for power feed (also via shielding blades).

With the 180° variants the new MicroSpeed Triple connectors are ideal for board-to-board connections (Mezzanine) or the board connection via Flex PCBs. Board-to-board distances of 5 mm (1mm male and 4mm female) can be realized. With the new MicroSpeed variant ERNI has further optimized the shielding, which results in significant reduction of coupling inductivity. The interference emissions are minimized while the connectors provide outstanding interference resistance (immunity, EMC protection).

The frame design with polarized mating face and self-centering, 1.5 mm wipe length and the robust blind-mate design provide safe and reliable usage for industrial requirements. In addition the dual-beam female contact design offers excellent tolerance compensation.

The impedance matched (50/100Ω) connectors are specified for the extended temperature range of -55 °C to +125 °C. The signal contacts feature SMT termination. The SMT coplanarity is fully guaranteed and specified with less than 0.10 mm for all the contacts. The longitudinal pitch of 1.0 mm and the row spacing of 1.5 mm permit horizontal and vertical arrangements of the differential pairs or single-ended signals - depending on the application and/or requirement with regard to crosstalk. Optimum crosstalk behavior can be achieved by means of special layout configurations - with ERNI providing support here in the form of field-tested suggestions. Corresponding test data are available upon request. Mating cycles > 500 are specified for the MicroSpeed connectors. The current carrying capacity is 1.0 A for the signal contacts and 10 A for the shielding.

MicroSpeed connectors are supplied in tape-on-reel packaging. Further design features for fully automatic assembly are: black insulators from high-temperature-resistant LCP for rapid and reliable visual detection in addition to a pre-mounted pick and place pad to facilitate gripping.

ERNI Electronic will introduce the new 3-row MicroSpeed connectors in Q1/2015 and present the new products at electronica (Hall B3, Booth 518) and SPS/IPC/DRIVES (Hall 2, Booth 650).

ERNI Electronics GmbH & Co. KG

Seestraße 9

73099 Adelberg

Germany

ERNI Asia Holding Pte Ltd

23A Serangoon North Avenue 5

#04-11

554369 Singapore

Singapore

ERNI Electronics China Ltd

Haide 3 Road 195#, Nanshan District

Room 1006, Block C, Tianli Central Plaza

518054 Shenzhen City

China

ERNI Electronics Inc.

2201, Westwood Avenue

23230 Richmond, VA

United States