Application Engineer for China
The ERNI Group of Companies has an excellent Technology Position in the connector industry, in particular with its high-speed connectors and broad range of backplane and board-to-board connectors. As ERNI is a leading Technology company we support our customers during their whole design in project and we provide highly sophisticated solutions based on our leading know how in High Speed Interconnect Technology. Therefore ERNI Asia is looking for an experienced professional to join as our
Application Engineer for China
Based according the preferences of the job applicant either in Shenzhen, Shanghai or Beijing and willing to travel in the whole region. He collaborates with ERNI Asia’s Headquarter in Singapore, Representative and sales offices in Shanghai, Shenzhen, Beijing, Taipei and ERNI’s central R & D in Germany
Responsibilities and Duties:
- Work on system/application engineering assignments
- Help customers to solve technical issues by providing appropriate solutions for a wide spectrum of design challenges
- Support fellow engineers in the field by providing strategic support services such as design evaluation, conversion and simulation
- Improve customer's knowledge and proficiency in product development with ERNI interconnect solutions through training, consultancy and leadership
- Analyze customer requirements and recommend appropriate solution
Requirements:
- Master’s / Bachelor’s in Electrical Engineering
- 2 -3 years hands-on experience in designing and developing hardware system and circuit/board design experience in datacom and/or telecom
- Familiar with majority of following technologies and standards:
- Telephony: Backbone, exchange, switching technology, wireless transmission, communication satellites, multiplexing, TDM, PDM
- Mobile Communications: GSM. CDMA, WCDMA, CDMA2000, TDSCDMA
- Data Communications: layered model, data communication protocols, LAN, TCP/IP, WAN
- Broadband and Convergence of Services: ISDN, xDSL, SDH, ATM, VoIP, xPON
- Experience with design tools and design flows, such as Cadence, Mentor, Synopsys or Concept
- Experience with high speed board design techniques with strong background in high frequency electronics and circuit design
- Experience in Board level pre layout and post layout simulations for signal integrity analysis.
- Experience with the following: Design for Manufacturing, Design for Compliance (EMI, Safety), Signal Integrity
- Highly self-motivated and initiative, Teamplayer
- Excellent problem solving skills
- Fluency in spoken and written in Mandarin & English
- Ability to stay in Germany for a limited time to get a comprehensive introduction to ERNI’s interconnect solutions
In addition to highly competitive remuneration and benefits we offer the opportunity to grow with the company in an attractive high tech environment. The company considers its staff as the key for future success
Please email your application and resume (in english) to following address: