Soldering technology

 

We can assemble your PCBs with electronic components using SMT (Surface Mount Technology), conventional wave soldering, THR process (Through Hole Reflow), manually or a combination of all technologies. These methods can use leaded or lead-free solders. We will ensure the requirements of your circuit boards and systems are met, regardless of the technology used. We will also gladly handle materials procurement for you.

Our Service

  • SMT and THR reflow soldering
  • THT wave soldering
  • Manual soldering
  • THT mounting (wave soldering)
  • Preparation of parts lists and documentation
  • Cost-efficient materials procurement thanks to the ERNI group's purchasing synergies
  • SMD assembly of fine-pitch components (µBGA, QFN, QFP, type 0201, ERNI MicroSpeed connectors, etc.)
  • Handling of moisture-sensitive components (Moisture Sensitivity Level 3)
  • Automated optical inspection (AOI) of SMT assemblies
  • Leaded and lead-free soldering
  • Manufacture and testing of assemblies according to IPC-A610 Class 2
  • Prototyping, small and medium production runs with up to 1,000 assemblies per batch

Equipment / SMT

  • Two SMD assembly lines
  • Stencil printer with built-in automatic solder paste inspection
  • Pick & place machines with an assembly capacity of up to 30,000 components per hour
  • Convection soldering systems with nitrogen atmosphere
  • Automated optical inspection unit (AOI)
  • Maximum PCB size: 510 x 460 mm
  • Maximum component height: 25 mm

Equipment / THT

  • Prototype production
  • Two THT assembly lines
  • Lead-free wave soldering system with nitrogen atmosphere
  • Leaded wave soldering system with nitrogen atmosphere
  • Automated assembly tables
  • Maximum PCB size: 480 x 280 mm
  • Maximum component height: 95 mm