I/O Connectors :: TMC :: ERNI D-Sub THR Process Instruction

The THR method is an attractive option for processing wired components during SMT assembly without leaving the production line.
The new ERNI D-Sub connectors are reflow/lead-free process compatible and free of halogen. Temperatures greater than 260 °C can be sustained without exhibiting any visual or functional impairment.
Wired D-Sub connectors are automatically or manually placed in plated-through holes of a pcb. Prior to this, soldering paste required for the solder joints is positioned in these holes via paste printing. What follows is the traditional process of soldering in the reflow or vapor phase oven.
D-Sub connectors are available with or without assembly force, depending on the type of assembly process (automatic or manual).
It is practical to carry out a soldering paste calculation before converting to the THR method. Doing this will allow you to estimate in advance as to whether the existing solder for the given geometric data will be able to meet the required quality standards.

Download Process Instruction as PDF-File (English Version)

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Download Process Instruction as PDF-File (German Version)

216 KB