MicroCon - 0.8 mm Dual-Row Connector System

The dual-row MicroCon series with 0.8 mm pitch is ideal for various demanding applications in the industrial, medical, lighting, automotive and consumer market. Due to the small dimensions - the 50-pin male connectors show dimensions of only 24.2 mm x 4.7 mm with different heights - robustness was crucial during the development. The male connectors are provided with reinforced side walls. Secure mating is ensured by coding and blind mate guide alignments, providing an increased locking range. A unique feature for this miniaturized device size is the double-sided spring contact. The reliable and high quality spring contacts are based on a proven and patented principle, which ERNI Electronics has been continuously scaled down for smaller dimensions.
To support various PCB applications parallel (Mezzanine), orthogonal (90 °) and coplanar configurations are available. With different heights for the male and female connectors Board-to-Board distances from 5 mm to 20 mm can be realized for Mezzanine applications. Despite the miniaturization the new connectors offer a high mating tolerance with allowed misalignment tolerances of longitudinal and transverse axes of ± 0.7 mm. The allowed angular inclination tolerance is specified with ± 4 degree.
The male connector is available with SMT termination. The robust plastic housing of the female connector withstands high temperature and is suitable for leadfree reflow soldering. Tape and reel packaging supports automatic assembly.

Initially available

• Vertical Female Connector (4 mm height)
• Vertical Male Connector (1 mm height)
• Angled versions, additional pin variants and heights as well as IDC-Cable assemblies will follow

Features

• Pitch: 0.8 mm
• Number of Pins: 12 to 140
• Board-to-Board distances: 5 - 20 mm
• Class 1 connector > 500 mating cycles
• Tin-plated pins
• Current capacity per contact: up to 0.5 A at 20°C
• Termination: SMT
• Tape-and-reel packaging for automatic assembly

IDC PCB-Terminal

One of the smallest terminals in the world

Features

•     IDC Technology, eliminates manual preparation of wires prior termination
•     Reliable contact due to gas tight connection and 2 IDC clamps
•     Replacement of hand soldering
•     Total height above pc board is less than most of other components
•     Minimal pcb space required
•     Available for AWG 24 wire (solid wire), wire diameter 0.5 mm; cable diameter 0.75 mm
•     Terminal press down cap guides and keep the wire in place
•     Versions with wire stop or daisy chain capability available
•     No special tool required for termination
•     Automated pick & place assembly
•     Tape and Reel packaging
•     Current rating max. 5.5 A at 20 °C
•     For more technical data please require testreport

SMC Enhancements

Additional Pin Counts in all Variations

ERNI Electronics is enhancing its popular two-row SMC connector family in a 1.27 mm pitch with versions featuring additional pins in all the available configurations (straight and angled male and female connectors plus female IDC connectors for ribbon cable systems). This means that SMC connectors are now also available with 16, 20, 32 and 40 pins, expanding the current range of 12, 26, 50, 68 and 80 contacts.
SMC connectors in a 1.27 mm pitch have been used successfully for roughly 20 years and have been consistently enhanced. The key design criteria of the SMC series are a patented, double-sided spring contact for good HF behavior and an extremely secure connection, a high-temperature-resistant insulator with polarization for extremely secure mating and SMT connection technology with 100% controlled coplanarity of the tiny contact pins.
Various modules such as straight and angled male and female connectors in combination with SMT and IDC connections offer users maximum scope for design. For miniature backplanes, male connectors in pressfit technology are also available.
The connectors are frequently used in a number of different locations within a system in order to achieve backplane, mezzanine, ribbon cable and coplanar connections. For further versatile subassembly designs, there are additional versions in various heights creating mezzanine distances from 8 to 20 mm. For extreme applications the distance can be increased up to 40 mm using board to board adapters.
The high quality SMC connectors are produced on state-of-the-art, fully automated manufacturing machines and are also designed for fully automated assembly. Thanks to their high contact density and the small board space required, SMC connectors are ideal for compact applications.

ERmet ZDHD

High-Speed Connector Sytem for Datarate up to 25 Gbit/s

ERNI’s new ZDHD connector is a high speed, differential board to backplane connector.  It is a higher density extension of our standard ERmet ZD product line. The ZDHD has an optimized footprint for improved electrical performance and is designed for data rates up to 25 Gbits/s.  ERNI’s ZD HD will be available in a 6-pair version.  Future additions to the product line will include a 2- and 4-pair version.

Features

• 14 rows per inch by 6 differential pairs per row
• 84 differential pairs per inch
• L-shield for each differential pair
• Impedance 100 Ohm, 85 Ohm on request
• Datarate up to 25 Gbit/s
• Superior crosstalk behavior
• Pitch 1,8 mm between rows
• Pitch 3,6 mm between diff. pair within a row
• Downsized pressfit technology 0.46 mm dia. hole
• Robust alignment guides on male side walls  

Technical Features

• Operating temperature: -55/125 °C  
• Mechanical operation: >250 mating cycles
• Insertion and withdrawal force: 0,7 N/pin (Signal)

Material

• Housing materaial: LCP  
• Contact material:
  Base material: Cu alloy
  Mating area: PdNi + Au
  Termination area: Sn

ERmet ZDplus

High Speed Differential Hard Metric Connector System

The ERmet ZDplus connector is an enhancement of the ERmet ZD family. This high-speed differential Hard Metric connector system enables data rates of 20 Gbit+.
The ERmet ZDplus is based on the principal mechanical design of the proven ERmet ZD with the same dimensions. To enable higher data rates ERNI Electronics has optimized the signal routing and the pressfit termination of the female connector. To benefit from the maximum performance of the new ERmet ZDplus the usage of backdrilling is recommended. Decreasing via stub length and the related “stub effect” by backdrilling significantly reduces the reflections and the overall BER (Bit Error Rate) of the interconnect.
The first product of the ERmet ZD+® family is the 4-pair right angle female connector with pressfit termination. The ERmet ZDplus female connector is mating compatible to the existing ERmet ZD male connector. This means, that existing backplane designs do not need layout changes on the backplane side, if customers want to upgrade their systems. Of course the layout on the daughtercards has to be modified if using the new ERmet ZDplus female parts.

Features

• Data rate performance per differential pair with standard ERmet ZD male connector max. 15 Gbit
  (optional with ERmet ZDplus male connector 20 Gbit+)
• 40 differential pairs per inch
• Mating compatible to standard ERmet ZD male connectors, backwards compatible to existing backplane systems
• Improved crosstalk behaviour
• Improved layout on daughter cards
• Meets the performance requirements of next generation processor technology